Method for interconnecting electrical device to a

专利名称：Method for interconnecting electrical device

to a module

发明人：Keith V. Guinn申请号：US13136096申请日：20110721公开号：US08567049B2公开日：20131029

专利附图：

摘要：An electrical assembly () includes a power IC such as a MOSFET () attached to asubstrate module (). The MOSFET includes a top surface comprising first and secondconductive device surfaces (A, B), associated with first and second device ports, and a

bottom surface comprising a third conductive device surface C associated with a thirddevice port. A first foil element is bonded to the first conductive device surface(s) A andto each of the first conductive substrate surfaces (A, A) and provides a continuous

conductive pathway from each conductive surface (A) to each other conductive surface (A)and to each conductive surface (A, A). A second foil element is bonded to the secondconductive device surface(s) B and to the second conductive substrate surface B andprovides a continuous conductive pathway from each device conductive surface (B) to thesubstrate conductive surface (B). A third foil element may be installed to electricallyinterconnect the discrete second device surfaces (B). The foil elements reduceinterconnection parasitics and reduce charge and thermal energy density at deviceconductive surfaces as compared to wire bonded electrical interconnections. The foilelements may be comprised of formed metal elements that are flexible but sufficientlyrigid to hold a formed shape or flexible foils supported on a flexible dielectric substrate.

申请人：Keith V. Guinn

地址：Thousand Oaks CA US

国籍：US

代理机构：Cantor Colburn LLP

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