Semiconductor flip-chip package and method for the

专利名称：Semiconductor flip-chip package and

method for the fabrication thereof

发明人：Miguel A. Capote,Zhiming Zhou,Xiaoqi

Zhu,Ligui Zhou

申请号：US10390603申请日：20030319

公开号：US20030218261A1公开日：20031127

专利附图：

摘要：A simplified process for flip-chip attachment of a chip to a substrate is providedby precoating the chip with an encapsulant underfill material having separate discrete

solder columns therein to eliminate the conventional capillary flow underfill process.Such a structure permits incorporation of remeltable layers for rework, test, or repair. Italso allows incorporation of electrical redistribution layers. In one aspect, the chip andpre-coated encapsulant are placed at an angle to the substrate and brought into contactwith the pre-coated substrate, then the chip and pre-coated encapsulant are pivotedabout the first point of contact, expelling any gas therebetween until the solder bumpson the chip are fully in contact with the substrate. There is also provided a flip-chipconfiguration having a complaint solder/flexible encapsulant understructure thatdeforms generally laterally with the substrate as the substrate undergoes expansion orcontraction. With this configuration, the complaint solder/flexible encapsulant

understructure absorbs the strain caused by the difference in the thermal coefficients ofexpansion between the chip and the substrate without bending the chip and substrate.

申请人：M. A. CAPOTE

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