专利名称：Teaching method and teaching system for a
bonding coordinate
发明人：Toshiaki Sasano申请号：US08/342426申请日：19941118公开号：US05583756A公开日：19961210
摘要：A system for teaching bonding coordinates of pads provided on a
semiconductor chip including: a first arithmetic control unit for processing images of padsobtained by a camera and calculates the amount of shift of centers of the images of thepads; and a second arithmetic control unit which, for the first and second pads, correctsthe bonding coordinates, thus producing new bonding coordinates for the first andsecond pads, and for the third and subsequent pads, the second arithmetic control unitmoves the camera a distance between new coordinates of two preceding pads andcorrects the coordinates of the moved camera, producing new bonding coordinates to bestored in a bonding coordinate memory.
申请人：KABUSHIKI KAISHA SHINKAWA
代理机构：Koda and Androlia
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