专利名称:Prepreg production method and prepeg
production device and prepreg obtained bythe production method and productionmethod for insulating layer attached copperfoil and insulating layer attached copper foilobtained by the production method
发明人:Tetsuro Sato,Noriyuki Nagashima申请号:US10470166申请日:20021212公开号:US07144472B2公开日:20061205
专利附图:
摘要:A production method capable of stably producing a prepreg and a copper foilwith thin insulating layer using a thin backbone material capable of securing excellentlaser hole-making property. A method for producing a prepreg for use in producing aprinted wiring board having a backbone material impregnated with a thermosetting resincomprising the following steps is adopted:
申请人:Tetsuro Sato,Noriyuki Nagashima
地址:Ageo JP,Ageo JP
国籍:JP,JP
代理机构:Rothwell, Figg, Ernst & Manbeck, P.C.
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