bq2002E/GNiCd/NiMH Fast-Charge Management ICs
Features
®
Fastchargeofnickelcadmiumornickel-metalhydridebatter-ies
DirectLEDoutputdisplayschargestatus
Fast-chargeterminationby-∆V,maximumvoltage,maximumtemperature,andmaximumtime
Internalband-gapvoltageref-erence
Optionaltop-offcharge
Selectablepulsetricklechargerates
Low-powermode
8-pin300-milDIPor150-milSOIC
General Description
Thebq2002Eandbq2002GFast-ChargeICsarelow-costCMOSbat-tery-chargecontrollersprovidingreli-ablechargeterminationforbothNiCdandNiMHbatteryapplications.Con-trollingacurrent-limitedorcon-stant-currentsupplyallowsthebq2002E/Gtobethebasisforacost-effectivestand-aloneorsystem-inte-gratedcharger.Thebq2002E/Ginte-gratesfastchargewithoptionaltop-offandpulsed-tricklecontrolinasingleICforchargingoneormoreNiCdorNiMHbatterycells.
Fastchargeisinitiatedonapplicationofthechargingsupplyorbatteryre-placement.Forsafety,fastchargeisinhibitedifthebatterytemperatureandvoltageareoutsideconfiguredlimits.
Fastchargeisterminatedbyanyofthefollowing:
nnnnn
Peakvoltagedetection(PVD)Negativedeltavoltage(-∆V)MaximumvoltageMaximumtemperatureMaximumtime
®®
®®®®®
Afterfastcharge,thebq2002E/Gop-tionallytops-offandpulse-tricklesthebatteryperthepre-configuredlimits.FastchargemaybeinhibitedusingtheINHpin.Thebq2002E/Gmayalsobeplacedinlow-standby-powermodetoreducesystempowercon-sumption.
Thebq2002Ediffersfromthebq2002Gonlyinthataslightlydif-ferentsetoffast-chargeandtop-offtimelimitsisavailable.Alldiffer-encesbetweenthetwoICsareillus-tratedinTable1.
Pin Connections
TMLEDBATVSS1234 8765CCINHVCCTSPin Names
TMLEDBATVSS
Timer mode select inputCharging status outputBattery voltage inputSystem ground
TSVCCINHCC
TemperaturesenseinputSupply voltage inputCharge inhibit inputCharge control output
8-Pin DIP orNarrow SOICPN-200201.epsbq2002E/G Selection Guide
Part No.
LBAT
TCO0.5∗VCC0.5∗VCC
HTF0.6∗VCC0.6∗VCC
LTFNone
bq2002E0.175∗
VCCbq2002G0.175∗
VCC
-∆VPVD
Fast Charge
C/21C2CC/21C2C
tMTO20080401608040
Top-OffNoneC/16NoneNoneC/16None
Maintenance
C/32C/32C/32C/32C/32C/32
None
2/99
1
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bq2002E/G
Pin Descriptions
TM
Timermodeinput
Athree-levelinputthatcontrolsthesettingsforthefastchargesafetytimer,voltageter-minationmode,top-off,pulse-trickle,andvoltagehold-offtime.
LED
Chargingoutputstatus
Open-drainoutputthatindicatesthechargingstatus.
BAT
Batteryinputvoltage
Thebatteryvoltagesenseinput.Theinputtothispiniscreatedbyahigh-impedancere-sistordividernetworkconnectedbetweenthepositiveandnegativeterminalsofthebattery.
VSSTS
Systemground
Temperaturesenseinput
Inputforanexternalbatterytemperaturemonitoringthermistor.
VCC
Supplyvoltageinput5.0V±20%powerinput.
INH
Chargeinhibitinput
Whenhigh,INHsuspendsthefastchargeinprogress.Whenreturnedlow,theICre-CC
sumesoperationatthepointwhereinitiallysuspended.
Chargecontroloutput
Anopen-drainoutputusedtocontrolthechargingcurrenttothebattery.CCswitch-ingtohighimpedance(Z)enableschargingcurrenttoflow,andlowtoinhibitchargingcurrent.CCismodulatedtoprovidetop-off,ifenabled,andpulsetrickle.
Functional Description
Figure2showsastatediagramandFigure3showsablockdiagramofthebq2002E/G.
BatteryVoltageandTemperatureMeasurements
Batteryvoltageandtemperaturearemonitoredformaximumallowablevalues.Thevoltagepresentedonthebatterysenseinput,BAT,shouldrepresentasingle-cellpotentialforthebatteryundercharge.Aresistor-dividerratioof
RB1
= N - 1RB2
isrecommendedtomaintainthebatteryvoltagewithinthevalidrange,whereNisthenumberofcells,RB1istheresistorconnectedtothepositivebatteryterminal,andRB2istheresistorconnectedtothenegativebat-teryterminal.SeeFigure1.
Note:Thisresistor-dividernetworkinputimpedancetoend-to-endshouldbeatleast200kΩandlessthan1MΩ.
VCCRTPACK +RB1BATR3TMVCCTSNTCbq2002E/GVSSRB2R4bq2002E/GVSSBAT pin connectionMid-levelsetting for TMThermistor connectionNTC = negative temperature coefficient thermistor.Fg2002E/G01.epsFigure 1.Voltage and Temperature Monitoring and TM Pin Configuration
2
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bq2002E/G
Chip onVCC 4.0VBattery Voltagetoo High?VBAT < 2VBattery Voltagetoo Low?0.175VCC < VBATVTS > 0.6VCCBattery Temperature?VTS < 0.6VCCChargePendingFastLED =LowVBAT > 2V orVTS < VCC/2 or((PVD or - V or Maximum Time Out)and TM Low)TrickleLED =FlashVBAT > 2VVBAT < 0.175VCCVBAT > 2V(PVD or -V orMaximum Time Out)and TM = LowTop-offLED = ZVBAT > 0.175 VCC,VBAT < 2V, andVTS > VCC/2VBAT 2VTrickleLED = ZSD2002C.epsVBAT2V orVTSVCC/2 orMaximum Time OutFigure 2.State Diagram
OSCClockPhaseGeneratorTimingControlSampleHistoryVoltageReference TMINHCharge-ControlState Machine PVD, - V ALUA to DConverterLBATCheckPower-OnResetCCLEDHTFTCOCheckCheckTSPowerDownVCCMCVCheckBATVSSBd2002CEG.epsFigure 3.Block Diagram
3
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bq2002E/G
VCC = 0Fast ChargingTop-Off(optional)Pulse-TrickleFast ChargingCC Output73msSee Table 11.17s1.17sCharge initiated by application of power Charge initiated by battery replacement LEDTD2002EG.epsFigure 4.Charge Cycle Phases
Aground-referencednegativetemperaturecoefficientther-mistorplacednearthebatterymaybeusedasalow-costtemperature-to-voltagetransducer.ThetemperaturesensevoltageinputatTSisdevelopedusingaresistor-thermistornetworkbetweenVCCandVSS.SeeFigure1.
1.ApplicationofpowertoVCCor
2.VoltageattheBATpinfallingthroughthemaximumcellvoltageVMCVwhere
VMCV= 2V±5%.
Ifthebatteryiswithintheconfiguredtemperatureandvoltagelimits,theICbeginsfastcharge.Thevalidbat-teryvoltagerangeisVLBAT Eitheroftwoeventsstartsachargecycle(seeFigure4): Table 1.Fast-Charge Safety Time/Hold-Off/Top-Off Table Typical Fast-Charge andTop-OffTime Limits(minutes) MaximumSynchro-nizedSamplingPeriod(seconds)18.718.79.4 Corre-spondingFast-Charge Rate C/21C2CNotes: TMMidLowHigh Termination PVDPVD-∆V TypicalPVDand -∆VHold-Off Time bq2002Ebq2002G(seconds)2008040 1608040 30015075 Top-Off RateDisabledC/16Disabled Pulse-TrickleRateC/32C/32C/32 Pulse-TrickleWidth(ms)733718 Typical conditions= 25°C,VCC= 5.0VMid = 0.5*VCC±0.5V Tolerance on all timing is±12%. 4 元器件交易网www.cecb2b.com bq2002E/G VLBAT= 0.175∗VCC±20% ThevalidtemperaturerangeisVTS>VHTFwhere VHTF= 0.6∗VCC±5%. Ifthebatteryvoltageortemperatureisoutsideoftheselimits,theICpulse-tricklechargesuntilthenextnewchargecyclebegins. IfVMCV nnnnn TheresponseoftheICtopulseslessthan100nsinwidthorbetween3.5msand12msisindeterminate.Tol-eranceonalltimingis±12%. VoltageTerminationHold-off Ahold-offperiodoccursatthestartoffastcharging.Duringthehold-offtime,thePVDand-∆Vterminationsaredisabled.Thisavoidsprematureterminationonthevoltagespikessometimesproducedbyolderbatterieswhenfast-chargecurrentisfirstapplied.Maximumvoltageandtemperatureterminationsarenotaffectedbythehold-offperiod. MaximumVoltage,Temperature,andTime AnytimethevoltageontheBATpinexceedsthemaxi-mumcellvoltage,VMCV,fastchargeoroptionaltop-offchargeisterminated. MaximumtemperatureterminationoccursanytimethevoltageontheTSpinfallsbelowthetemperaturecut-offthresholdVTCOwhere VTCO= 0.5∗VCC±5%. MaximumchargetimeisconfiguredusingtheTMpin.TimesettingsareavailableforcorrespondingchargeratesofC/2,1C,and2C.Maximumtime-outtermina-tionisenforcedonthefast-chargephase,thenreset,andenforcedagainonthetop-offphase,ifselected.Thereisnotimelimitonthetrickle-chargephase. Peakvoltagedetection(PVD)Negativedeltavoltage(-∆V)MaximumvoltageMaximumtemperatureMaximumtime PVDand-∆VTermination Therearetwomodesforvoltagetermination,dependingonthestateofTM.For-∆V(TM=high),ifVBATislowerthananypreviouslymeasuredvalueby12mV±3mV,fastchargeisterminated.ForPVD(TM=lowormid),ade-creaseof2.5mV±2.5mVterminatesfastcharge.ThePVDand-∆Vtestsarevalidintherange1V VoltagesamplingattheBATpinforPVDand-∆Vtermi-nationmaybesynchronizedtoanexternalstimulusus-ingtheINHinput.Low-high-lowinputpulsesbetween100nsand3.5msinwidthmustbeappliedattheINHpinwithafrequencygreaterthanthe“maximumsyn-chronizedsamplingperiod”setbythestateoftheTMpinasshowninTable1.Voltageissampledonthefal-lingedgeofsuchpulses. Ifthetimebetweenpulsesisgreaterthanthesynchro-nizingperiod,voltagesampling“free-runs”atonceevery17seconds.Asampleistakenbyaveragingtogethervoltagemeasurementstaken57µsapart.TheICtakes32measurementsinPVDmodeand16measurementsin-∆Vmode.Theresultingsampleperiods(9.17and18.18ms,respectively)filteroutharmonicscenteredaround55and109Hz.Thistechniqueminimizestheef-fectofanyAClineripplethatmayfeedthroughthepowersupplyfromeither50or60HzACsources. IftheINHinputremainshighformorethan12ms,thevoltagesamplehistorykeptbytheICandusedforPVDand-∆Vterminationdecisionsiserasedandanewhis-toryisstarted.Sucharesetisrequiredwhentransition-ingfromfree-runningtosynchronizedvoltagesampling. Top-offCharge Anoptionaltop-offchargephasemaybeselectedtofollowfastchargeterminationfor1CandC/2rates.ThisphasemaybenecessaryonNiMHorotherbat-terychemistriesthathaveatendencytoterminatechargebeforereachingfullcapacity.Withtop-offen-abled,chargingcontinuesatareducedrateafterfast-chargeterminationforaperiodoftimeselectedbytheTMpin.(SeeTable1.)Duringtop-off,theCCpinismodulatedatadutycycleof73msactiveforevery1097msinactive.Thismodulationresultsinanaveragerate1/16ththatofthefastchargerate.Maxi-mumvoltage,time,andtemperaturearetheonlyter-minationmethodsenabledduringtop-off. Pulse-TrickleCharge Pulse-trickleisusedtocompensateforself-dischargewhilethebatteryisidleinthecharger.Thebatteryispulse-tricklechargedbydrivingtheCCpinactiveonceevery1.17sfortheperiodspecifiedinTable1.Thisre-sultsinatricklerateofC/32. TMPin TheTMpinisathree-levelpinusedtoselectthechargetimer,top-off,voltageterminationmode,trickle 5 元器件交易网www.cecb2b.com bq2002E/G rate,andvoltagehold-offperiodoptions.Table1de-scribesthestatesselectedbytheTMpin.Themid-levelselectioninputisdevelopedbyaresistordi-viderbetweenVCCandgroundthatfixesthevoltageonTMatVCC/2±0.5V.SeeFigure4. Low-PowerMode TheICentersalow-powerstatewhenVBATisdrivenabovethepower-downthreshold(VPD)where VPD= VCC- (1V±0.5V) BoththeCCpinandtheLEDpinaredriventothehigh-Zstate.Theoperatingcurrentisreducedtolessthan1µAinthismode.WhenVBATreturnstoavaluebelowVPD,theICpulse-tricklechargesuntilthenextnewchargecyclebegins. ChargeStatusIndication AfastchargeinprogressisuniquelyindicatedwhentheLEDpingoeslow.TheLEDpinisdriventothehigh-Zstateforallconditionsotherthanfastcharge.Figure2outlinesthestateoftheLEDpinduringcharge. ChargeInhibit Fastchargeandtop-offmaybeinhibitedbyusingtheINHpin.Whenhigh,INHsuspendsallfastchargeandtop-offactivityandtheinternalchargetimer.INHfreezesthecurrentstateofLEDuntilinhibitisremoved.TemperaturemonitoringisnotaffectedbytheINHpin.Duringchargeinhibit,thebq2002E/Gcontinuestopulse-tricklechargethebatterypertheTMselection.WhenINHreturnslow,chargecontrolandthechargetimerresumefromthepointwhereINHbecameactive. 6 元器件交易网www.cecb2b.com bq2002E/G Absolute Maximum Ratings SymbolVCCVTTOPRTSTGTSOLDERTBIASNote: Parameter VCCrelative toVSS DC voltage applied on any pinexcludingVCCrelative toVSSOperating ambient temperatureStorage temperatureSoldering temperatureTemperature under bias Minimum-0.3-0.30-40--40 Maximum+7.0+7.0+70+85+260+85 UnitVV°C°C°C°C 10 sec max.Commercial Notes Permanent device damage may occur ifAbsolute Maximum Ratingsare exceeded.Functional opera-tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet.Expo-sure to conditions beyond the operational limits for extended periods of time may affect device reliability. DC Thresholds SymbolVTCOVHTFVMCVVLBAT-∆VPVD (TA= 0 to 70°C;VCC±20%) Rating0.5*VCC0.6∗VCC 20.175∗VCC -12-2.5 Tolerance±5%±5%±5%±20%±3±2.5 UnitVVVVmVmV Notes VTS≤VTCOinhibits/terminatesfast charge and top-off VTS VBAT Temperature cutoffHigh temperature faultMaximum cell voltageMinimum cell voltageBAT input change for-∆VdetectionBAT input change forPVDdetection 7 元器件交易网www.cecb2b.com bq2002E/G Recommended DC Operating Conditions(TA= 0 to 70°C) SymbolVCCVDETVBATVTSVIHConditionSupply voltage-∆V,PVD detect voltageBattery inputThermistor inputLogic input highLogic input highVIMLogic input midMinimum4.0100.50.5VCC- 0.5VCC2VILLogic input lowLogic input lowVOLVPDLogic output lowPower down---VCC- 1.5- 0.5Typical5.0------VCC2----Maximum6.02VCCVCC--+0.5UnitVVVVVVVVTS< 0.5V prohibitedINHTMTMNotes0.10.50.8VCC- 0.5VVVVINHTMLED,CC,IOL=10mAVBAT≥VPDmax.powersdown bq2002E/G;VBAT< VPDmin.=normal operation.Outputs unloaded,VCC= 5.1VVCC= 5.1V,VBAT= VPD@VOL= VSS+ 0.8VINH,CC,V = VSSto VCCLED,CCICCISBIOLILIOZNote: Supply currentStandby currentLED,CCsinkInput leakageOutput leakage inhigh-Z stateAll voltages relative to VSS. --10--5-----5001-±1-µAµAmAµAµA8 元器件交易网www.cecb2b.com bq2002E/G Impedance SymbolRBATRTS Parameter Battery input impedanceTS input impedance Minimum 5050 Typical --Maximum --UnitMΩMΩ Timing SymboldFCVtDLYNote: (TA= 0 to +70°C;VCC±10%) Parameter Time base variationStart-up delay Minimum-120.35 Typical -- Maximum 120.9 Unit%s Notes Starting fromVMCV 9 元器件交易网www.cecb2b.com bq2002E/G 8-Pin DIP(PN) 8-Pin PN(0.300\" DIP) Inches DMillimetersMin.4.060.380.381.400.208.897.625.847.622.292.920.51 Max.4.571.020.561.650.339.658.267.119.402.793.811.02 Dimension AA1BB1C ALA1B1Min.0.1600.0150.0150.0550.0080.3500.3000.2300.3000.0900.1150.020 Max.0.1800.0400.0220.0650.0130.3800.3250.2800.3700.1100.1500.040 E1EDEE1eG CSeGBLS 8-Pin SOIC Narrow (SN) 8-Pin SN(0.150\" SOIC) Inches Dimension AA1BCDEeHL Min.0.0600.0040.0130.0070.1850.1500.0450.2250.015 Max.0.0700.0100.0200.0100.2000.1600.0550.2450.035 MillimetersMin.1.520.100.330.184.703.811.145.720.38 Max.1.780.250.510.255.084.061.406.220.89 10 元器件交易网www.cecb2b.com bq2002E/G DataSheetRevisionHistory Change No. 1 Notes: Page No. 1 Added selection guide Description Nature of Change Change 1 = Feb.1999 B changes from Sept.1997 Ordering Information bq2002E/G PackageOption: PN=8-pinplasticDIPSN=8-pinnarrowSOIC Device: bq2002EFastChargeICbq2002GFastChargeIC 11 元器件交易网www.cecb2b.com IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright © 1999, Texas Instruments Incorporated 元器件交易网www.cecb2b.com IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK. In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof. Copyright © 1999, Texas Instruments Incorporated 因篇幅问题不能全部显示,请点此查看更多更全内容