Polisher for chemical mechanical planarization

专利名称：Polisher for chemical mechanical

planarization

发明人：Hsin-Hsien Lu,Liang-Guang Chen,Tien-I

Bao,Shau-Lin Shue

申请号：US11727119申请日：20070323公开号：US08348719B2公开日：20130108

专利附图：

摘要：Embodiments of a polisher for chemical mechanical planarization. The polisherincludes a polishing pad structure containing a first reactant therein, and a second

reactant in a polishing environment over the polishing pad structure. The first reactantand the second reactant react endothermically upon contact when polishing a wafersurface between the polishing pad structure and the polishing environment.

申请人：Hsin-Hsien Lu,Liang-Guang Chen,Tien-I Bao,Shau-Lin Shue

地址：Hsinchu TW,Hsinchu TW,Hsinchu TW,Hsinchu TW

国籍：TW,TW,TW,TW

代理机构：Birch, Stewart, Kolasch & Birch, LLP

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