Method of manufacturing a connecting structure for

专利名称：Method of manufacturing a connecting

structure for covered wires

发明人：Tetsuro Ide申请号：US09438661申请日：19991112公开号：US06334251B1公开日：20020101

专利附图：

摘要：A method for manufacturing a connecting structure for covered wires isprovided at first, a shield wire () and a ground wire () are prepared. After overlapping theground wire () on the shield wire across each other, respective overlapping portions of

the wires () are interposed between an upper resin tip () and a lower resin tip (). Next, theupper and lower resin tips () are oscillated with ultrasonic waves while compressing theupper and lower resin tips () from the outside. Consequently, respective outside rinds ()of the wires () are molten for removal, so that a braided wire () comes into electricalcontact with a core line () the upper resin tip () is provided, on its butt face, with a stopper() for defining the position of a leading end of the ground wire (), while the lower resin tip() is provided, on its butt face, with a recess () for receiving the stopper ().

申请人：YAZAKI CORPORATION

代理机构：Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.

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