专利名称：Ceramic substrate part and electronic part
comprising it
发明人：Fumitake Taniguchi申请号：US12442616申请日：20070926公开号：US08064219B2公开日：20111122
专利附图：
摘要：A ceramic substrate part comprising on its upper surface pluralities of externalelectrodes comprising wire-bonding electrodes, each of which comprises a primer layerbased on Ag or Cu, a Ni-based lower layer, an intermediate layer based on a Pd—P alloy
containing 0.4-5% by mass of P, and a Au-based upper layer formed in this order on aceramic substrate, the upper layer containing Pd after heated by soldering, and having aAu concentration of 80 atomic % or more based on the total concentration (100 atomic%) of Au and Pd.
申请人：Fumitake Taniguchi
地址：Tottori JP
国籍：JP
代理机构：Sughrue Mion, PLLC
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