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Method and device for heat treatment

2022-07-01 来源:易榕旅网
专利内容由知识产权出版社提供

专利名称:Method and device for heat treatment发明人:Takaaki Matsuoka申请号:US10466604申请日:20020124公开号:US06951815B2公开日:20051004

专利附图:

摘要:After carrying an LCD substrate in a reaction container of a heat treatment unit,blowing a previously heated helium gas from a gas supply part, which opposes to thesurface of the LCD substrate, over the entire surface of the LCD substrate. Thetemperature of the LCD substrate is raised by radiation heat of a heater and heat

exchange with the helium gas. After performing CVD or annealing in the reactioncontainer, cooling the LCD substrate by blowing a gas for heat exchange having a

temperature about a room temperature from the gas supply part over the entire surfaceof the LCD substrate. Return the cooled LCD substrate to a carrier in the carrier chambervia a conveyance chamber.

申请人:Takaaki Matsuoka

地址:Tokyo JP

国籍:JP

代理机构:Crowell & Moring LLP

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