专利名称：Semiconductor package and semiconductor
module
发明人：Takagi, Kazutaka申请号：EP14181195.0申请日：20140815公开号：EP2889952A3公开日：20150812
专利附图：
摘要：According to one embodiment, a semiconductor package includes: a first metalbody on which a part of a waveguide structure is formed; a second metal body including amounting area for a semiconductor device and disposed on the first metal body; a line
substrate on which a signal transmission line configured to communicate a waveguidewith the semiconductor device mounted on the mounting area is formed; and a lid bodydisposed at a position facing the first metal body, interposing the second metal body andthe line substrate. The lid body is made of resin, on which a structure corresponding toanother waveguide structure on an extension of the waveguide structure in the firstmetal body is formed. The structure includes a metal-coated inner wall surface.
申请人：Kabushiki Kaisha Toshiba
地址：1-1, Shibaura 1-chome, Minato-ku Tokyo JP
国籍：JP
代理机构：Granleese, Rhian Jane
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