专利名称：Semiconductor device, semiconductor
integrated circuit and bump resistancemeasurement method
发明人：Kazutoshi Shimizume,Takaaki Yamada申请号：US11893573申请日：20070816公开号：US07626411B2公开日：20091201
专利附图：
摘要：The present invention provides a semiconductor device, including: a firstsemiconductor chip, and a second semiconductor chip connected to the first
semiconductor chip through a plurality of bumps having not only a number of mainbumps necessary for operation between the chips but also a predetermined number ofmeasurement and control input bumps. Each of the first and second chips includes aplurality of measurement path switches individually connected to the main bumps, aplurality of current path switches connected to connecting points between the mainbumps and the measurement path switches, and a control circuit for the measurementpath switches, the first semiconductor chip further including a plurality of measurementand control terminals for inputting a control signal of the control circuit and supplyingfixed current to be supplied to the current path switches and then measuring the voltageat the connecting points.
申请人：Kazutoshi Shimizume,Takaaki Yamada
地址：Kanagawa JP,Kanagawa JP
国籍：JP,JP
代理机构：Rockey, Depke & Lyons, LLC
代理人：Robert J. Depke
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