Leadframe for semiconductor devices

专利名称：Leadframe for semiconductor devices发明人：Atsuhiko Izumi申请号：US08/307429申请日：19940919公开号：US05623163A公开日：19970422

摘要：A leadframe for semiconductor derides having patterned die- mountingstructures arranged along the longitudinal axis of the leadframe. Each of the structurescontains a die pad for mounting a semiconductor device chip thereon, die pad supportsfor supporting the die pad, fingers for forming inner leads and outer leads, and tiebarsfor preventing leakage of a molding material during a molding process. At least one ofthe die pad supports has a first communication path through which a molding materialflows from one side of the body to the other thereof. The molding material supplied intoone side of the leadframe can flow to the other side thereof through not only the gapsbetween the die pad and the body but also the first communication path during amolding process, resulting in a small flow rate difference of the molding material.Failures such as visible voids and no fillings are not produced in the plastic-moldingpackage.

申请人：NEC CORPORATION

代理机构：Burns, Doane, Swecker & Mathis, LLP

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