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IC datasheet pdf-CD4030B,pdf(TYPES)

2024-04-23 来源:易榕旅网
Data sheet acquired from Harris SemiconductorSCHS035C – Revised September 2003The CD4030B types are supplied in 14-leadhermetic dual-in-line ceramic packages (F3Asuffix), 14-lead dual-in-line plastic packages (Esuffix), 14-lead small-outline packages (M, MT,M96, and NSR suffixes), and 14-lead thin shrinksmall-outline packages (PW and PWR suffixes).Copyright© 2003, Texas Instruments IncorporatedPACKAGEOPTIONADDENDUM

www.ti.com

15-Oct-2009

PACKAGINGINFORMATION

OrderableDevice

CD4030BECD4030BEE4CD4030BFCD4030BF3ACD4030BMCD4030BM96CD4030BM96E4CD4030BM96G4CD4030BME4CD4030BMG4CD4030BMTCD4030BMTE4CD4030BMTG4CD4030BNSRCD4030BNSRE4CD4030BNSRG4CD4030BPWCD4030BPWE4CD4030BPWG4CD4030BPWRCD4030BPWRE4CD4030BPWRG4JM38510/05353BCA

(1)

Status(1)ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE

PackageTypePDIPPDIPCDIPCDIPSOICSOICSOICSOICSOICSOICSOICSOICSOICSOSOSOTSSOPTSSOPTSSOPTSSOPTSSOPTSSOPCDIP

PackageDrawing

NNJJDDDDDDDDDNSNSNSPWPWPWPWPWPWJ

PinsPackageEcoPlan(2)

Qty1414141414141414141414141414141414141414141414

25251150

Pb-Free(RoHS)Pb-Free(RoHS)TBDTBDGreen(RoHS&noSb/Br)

Lead/BallFinishCUNIPDAUCUNIPDAU

A42A42CUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAU

A42

MSLPeakTemp(3)N/AforPkgTypeN/AforPkgTypeN/AforPkgTypeN/AforPkgTypeLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMN/AforPkgType

2500Green(RoHS&

noSb/Br)2500Green(RoHS&

noSb/Br)2500Green(RoHS&

noSb/Br)5050250250250

Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)909090

Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)1

TBD

Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.

LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.

NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.

PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.

Addendum-Page1

PACKAGEOPTIONADDENDUM

www.ti.com

15-Oct-2009

OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.

(2)

EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://www.ti.com/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.

Pb-Free(RoHS):TI'sterms\"Lead-Free\"or\"Pb-Free\"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitableforuseinspecifiedlead-freeprocesses.

Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.

Green(RoHS&noSb/Br):TIdefines\"Green\"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)

(3)

MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.

ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinformation.Effortsareunderwaytobetterintegrateinformationfromthirdparties.TIhastakenandcontinuestotakereasonablestepstoproviderepresentativeandaccurateinformationbutmaynothaveconducteddestructivetestingorchemicalanalysisonincomingmaterialsandchemicals.TIandTIsuppliersconsidercertaininformationtobeproprietary,andthusCASnumbersandotherlimitedinformationmaynotbeavailableforrelease.

InnoeventshallTI'sliabilityarisingoutofsuchinformationexceedthetotalpurchasepriceoftheTIpart(s)atissueinthisdocumentsoldbyTItoCustomeronanannualbasis.

Addendum-Page2

PACKAGEMATERIALSINFORMATION

www.ti.com

30-Jul-2010

TAPEANDREELINFORMATION

*Alldimensionsarenominal

Device

PackagePackagePinsTypeDrawingSOICSOTSSOP

DNSPW

141414

SPQ

ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0330.0330.0

16.416.412.4

6.58.26.9

B0(mm)9.010.55.6

K0(mm)2.12.51.6

P1(mm)8.012.08.0

WPin1(mm)Quadrant16.016.012.0

Q1Q1Q1

CD4030BM96CD4030BNSRCD4030BPWR

250020002000

PackMaterials-Page1

PACKAGEMATERIALSINFORMATION

www.ti.com

30-Jul-2010

*Alldimensionsarenominal

DeviceCD4030BM96CD4030BNSRCD4030BPWR

PackageType

SOICSOTSSOP

PackageDrawing

DNSPW

Pins141414

SPQ250020002000

Length(mm)

346.0346.0346.0

Width(mm)346.0346.0346.0

Height(mm)

33.033.029.0

PackMaterials-Page2

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