专利名称：Thermal conductor assembly发明人：Dentini, Mark S.,Fulton, Joe. A.,Jin,
Sungho,Mottine, John Joseph, Jr.,Shepherd,Lloyd,Sherwood, Richard Curry
申请号：EP88305793.7申请日：19880624公开号：EP0297793A2公开日：19890104
摘要：A compressible thermally conductive member comprises a polymer field withthermally conducting magnetically aligned particles comprising a base portion and amultiplicity of protrusions extending from at least one surface of the base portion.
申请人：AT&T Corp.
地址：32 Avenue of the Americas New York, NY 10013-2412 US
国籍：US
代理机构：Johnston, Kenneth Graham
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