专利名称：Thermal conductor assembly发明人：Dentini, Mark S.,Fulton, Joe. A.,Jin,
Sungho,Mottine, John Joseph, Jr.,Shepherd,Lloyd,Sherwood, Richard Curry
申请号：EP88305793.7申请日：19880624公开号：EP0297793B1公开日：19920902
摘要：A compressible thermally conductive member comprises a polymer field withthermally conducting magnetically aligned particles comprising a base portion and amultiplicity of protrusions extending from at least one surface of the base portion.
申请人：AMERICAN TELEPHONE AND TELEGRAPH COMPANY
地址：550 MADISON AVENUE; NEW YORK, NY 10022
代理机构：Johnston, Kenneth Graham
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容