专利名称：Manufacturing method for electronic
devices
发明人：Yoichiro Kurita申请号：US12292378申请日：20081118公开号：US07772032B2公开日：20100810
专利附图：
摘要：A manufacturing method for manufacturing an electronic device includes a firstelectronic component and a second electronic component; and a bond part for the firstelectronic component joined to another bond part for the second electronic component.
In a first process of this manufacturing method, the metallic bond part for the firstelectronic component is placed directly against the metallic bond part for the secondelectronic component, pressure is applied to the first electronic component and thesecond electronic component and, after metallically joining the above two bond parts,the pressure applied to the first electronic component and the second electroniccomponent is released. In a second process in the manufacturing method, a clampingmember affixes the relative positions of the joined first electronic component and secondelectronic component, and heats the first electronic component and the secondelectronic component to maintain a specified temperature.
申请人：Yoichiro Kurita
地址：Kanagawa JP
国籍：JP
代理机构：McGinn IP Law Group, PLLC
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