Methods for forming a die package

专利名称：Methods for forming a die package发明人：Juan G. Milla申请号：US10136197申请日：20020429

公开号：US20020127837A1公开日：20020912

专利附图：

摘要：Methods are provided for forming a die package. The method comprisesstiffening a flexible substrate to provide a first flexibility of the flexible substrate,forming a mounting element on a first side of the flexible substrate, and mounting a firstdie on the first side of the flexible substrate to couple the first die to the mounting

element. Further, the method comprises mounting a second die on a second side of theflexible substrate and mounting a third die on the second side of the flexible substrate tocouple the second and third die to the mounting element, respectively. Furthermore, themethod comprises adjusting the stiffening to provide a second flexibility of the flexiblesubstrate that is greater than the first flexibility, and stacking the second die and thethird die to provide an overlap of a portion of the second die and a portion of the thirddie.

申请人：MEDTRONIC, INC.

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