专利名称:MODULAR INVERTER ARRANGEMENT发明人:Pertti SEVÄKIVI,Teemu Heikkilä申请号:US13909607申请日:20130604
公开号:US20130320896A1公开日:20131205
专利附图:
摘要:An arrangement for a modular inverter includes a number of power
semiconductors and cooling elements, where the cooling elements are connected to thepower semiconductors for cooling the power semiconductors. The power
semiconductors and the cooling elements are disposed around a center axis of the
arrangement in such a manner that they demark a channel around the center axis in whicha cooling medium is able to flow in the direction of the center axis. The arrangementincludes a first tube-shaped ring film capacitor around the center axis of the
arrangement. The power semiconductors are arranged between the cooling elementsand an inner surface of the first tube-shaped ring film capacitor.
申请人:ABB Oy
地址:Helsinki FI
国籍:FI
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