专利名称：Method for encapsulating a microelectronic
device
发明人：Nicolas, Stéphane,Baillin, Xavier申请号：EP13178131.2申请日：20130726公开号：EP2692689B1公开日：20190306
摘要：At least one microelectronic component (100) of packaging method, at leastincludes the following steps: Microelectronic component is encapsulated in chamber(104) seal gas cover, penetrates at least one inert gas (110) including at least one wall(109) Gas-permeable wall in inert gas injection chamber is noble, Seal chamber is to airand inert gas injection type chamber.
申请人：Commissariat à l'Énergie Atomique et aux Énergies Alternatives
代理机构：Ahner, Philippe
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容