专利名称：Cleaning composition for semiconductor
substrates
发明人：Wu, Aiping申请号：EP08100095.2申请日：20080104公开号：EP1944355B1公开日：20091007
摘要：The present invention relates to a semi-aqueous cleaning composition used toremove unwanted organic and inorganic residues and contaminants from semiconductorsubstrates. The cleaning composition comprises a buffering system comprising a
polyprotic acid having at least three carboxylic acid groups with a pKa value of about 5 toabout 7. The composition also comprises a polyhydric solvent, such as glycerol. A fluorideion source is also included in the cleaning compositions of the present invention and isprincipally responsible for removing inorganic residues from the substrate. The cleaningcompositions of the present invention have a low toxicity and are environmentallyacceptable.
申请人：AIR PROD & CHEM
地址：US
国籍：US
代理机构：Muir, Benjamin M. J.
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