专利名称：Metallic Ink, and Method for Forming of
Electrode Using the Same and Substrate
发明人：Chang-woo Park,Dong-kyu Park申请号：US12118653申请日：20080509
公开号：US20090004445A1公开日：20090101
摘要：Disclosed is a metallic ink, a method of forming electrodes using the metallicink, and a substrate using the metallic ink. The metallic ink comprises at least one oxideselected from metal oxide nanoparticles and partially polycondensated metal oxideshaving a size of 100 nm or less, and metal nanoparticles having a size of 100 nm or less.The oxides and the metal nanoparticles are dispersed as isolated ultrafine particles insolvent. The method comprises patterning the ink using an inkjet printer to form aconductive wire. The substrate is produced through the method. It is thereby possible toconduct patterning using an inkjet printer, and adhesive power to substrates is improved.The metallic ink is useful to produce electrodes of various panels, such as PDPs.
申请人：Chang-woo Park,Dong-kyu Park
地址：Daejeon-si KR,Cheongju KR
国籍：KR,KR
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