专利名称：INTEGRATED CIRCUIT PACKAGE SYSTEM
INCLUDING SHIELD
发明人：Marcos Karnezos申请号：US12762602申请日：20100419
公开号：US20100200967A1公开日：20100812
专利附图：
摘要：An integrated circuit package system includes: a substrate; a first deviceattached to the substrate; a shield attached to the substrate and surrounding the firstdevice; apertures formed within the shield; the shield configured to block
electromagnetic energy that passes through the apertures; and an encapsulationmaterial deposited through the apertures.
申请人：Marcos Karnezos
地址：Palo Alto CA US
国籍：US
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