专利名称：Polishing pad, use thereof and method for
manufacturing the same
发明人：Chung-Chih Feng,I-Peng Yao,Lyang-Gung
Wang,Yung-Chang Hung
申请号：US11706189申请日：20070215
公开号：US20080200102A1公开日：20080821
专利附图：
摘要：The present invention mainly relates to a polishing pad comprising a basematerial comprising fibers; a membrane with low permeability; and a buffer layer formed
between the base material and an upper surface of the membrane with low permeabilityand embedded into the fibers of the base material. A method of polishing a substratecomprising using the polishing pad and a method for manufacturing the polishing pad asdescribed above are also provided.
申请人：Chung-Chih Feng,I-Peng Yao,Lyang-Gung Wang,Yung-Chang Hung
地址：Kaohsiung TW,Kaohsiung TW,Kaohsiung TW,Kaohsiung TW
国籍：TW,TW,TW,TW
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