WAFER POLISHING AND PAD CONDITIONING METHODS

专利名称：WAFER POLISHING AND PAD

CONDITIONING METHODS

发明人：LAWING, ANDREW, SCOTT申请号：US2004005563申请日：20040223

公开号：WO2004077520A3公开日：20041014

摘要：Polishing pads having a surface morphology that results in a high degree ofplanarization efficiency when planarizing a wafer surface are disclosed. One conditionedpolishing pad is non-porous and has a surface height distribution with a surface

roughness Ra < 3 microns. Another conditioned polishing pad is porous and has a surfaceheight probability distribution with a pad surface height Ratio R >= 60%, or alternativelyhas an asymmetric surface height probability distribution characterized by an asymmetryfactor A10 <=0.50. Methods of pad conditioning and planarizing a wafer using thepolishing pads are also disclosed.

申请人：ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.

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